Mask Alignment System with Double Image Microscope (MAS + DIM )

The mask aligner is designed to accurately align masks with substrates. Using for example a shadow mask permits to do a lithography free thin film deposition. Once the wafer aligned under the mask the two substrates will be clamped in a double chuck. The clamped double chuck with substrates can then be inserted in PVD chamber for evaporation. After the deposition the double chuck will be separated and the substrates can be taken out.

idonus MAS+DIM: Both systems can be combined.

In addition to shadow masking, the idonus mask aligner has a wide range of applications such as:

  • Shadow masking
  • UV light masking
  • Nanoimprinting
  • Bonding alignment
and more...

Vacuum clamping ability and 3-axis manual alignment make this mask aligner very easy to use.

The aligner has been designed to be used with several wafer sizes and shapes, standard or not. idonus manufactures the chucks according to your needs.

Combined with a microscope an alignment tolerance of minimum ± 5 μm can be achieved. idonus proposes his own double image microscope for alignment control. The user can focus and visualize two alignment locations at the same time to simplify the alignment process.

Mask Alignment System (MAS )

The idonus MAS mask aligner contains the essential elements you need to run your alignment process.

Standalone equipment with removable stage for chuck charging and alignment.

Z-axis for chuck contacting.

Vacuum control to command and adjust clamping force on wafer and chucks.

Double chuck for wafer and mask handling. Once clamped it is directly used for further processing.

Double Image Microscope (DIM )

Using the idonus Double Image Microscope (DIM) enables a precise alignment of ± 5 µm. The alignment is monitored on a PC by two cameras. The equipment was designed to be combined with our Mask Aligner (i.e., MAS+DIM system) but it can be used as a standalone equipment as well.

idonus Double Image Microscope (DIM) – The cameras are connected to a PC via USB 3.0 ports (as shown in the close-up view, the cameras have a USB 3.0 Micro-B Super Speed port).
The DIM can can be used as a standalone equipment or combined with the MAS.

Operation of the shadow mask aligner

Illustrations No. 1 – 6 show the main steps that one needs to complete for shadow mask alignment. After step #6, the stacked assembly is ready for the next process (e.g., PVD, sputtering, etc.).

All these steps, including alignment with the DIM are shown in our video presentation of the MAS-DIM equipment.

1. Top and bottom chuck with clamped wafer and mask.

2. Top chuck with mask is in alignment position, wafer on bottom chuck is ready to be loaded.

3. Alignment of wafer and mask with the x, y and rotation axis.

idonus MAS-DIM: Shadow Mask Aligner combined with a Double Image Microscope

4. After the alignment both chucks are mechanically clamped together.

5. Unloading of the chucks.

6. Operation is completed. Chucks with substrates are ready for the next process.

Ask for a quotation

Please note that we do not publish any price list online.

If you are interested in one of our products, please contact us to get a quotation (either through one of our sales partners, or directly to our headquarters).

If you feel that one of our standard products would need adaption work to suit your application, please do not hesitate to ask us for advice on engineering work. We can find solutions.