Chip-to-chip bonder (CCB )

Precise alignment and bonding of two single chips is very often needed for building three dimensional structures or packaging in MEMS fabrication. With the chip-to-chip bonder (CCB ), it becomes possible to align two chips manually. The chips can then be brought into contact in order to perform anodic bonding or various gluing processes. The single chip alignment stage includes three linear axes and three rotation axes, which provide enough degrees of freedom for most alignment applications. The lower chip is clamped on a base plate, the upper chip is held by a needle. Both vacuum holders can be adjusted and switched separately. In order to perform the anodic bonding process, a heating plate as well as a high voltage source are provided. The bond-voltage is adjusted on a controller unit, which monitors the voltage and the bond-current. The temperature of the heating plate is also adjusted on the controller unit.



Download


Download our product brochure (PDF).





Electrostatic chuck

idonus chip-to-chip bonder equipment (CCB).




Ask for a quotation

Please note that we do not publish any price list online.

If you are interested in one of our products, please contact us to get a quotation (either through one of our sales partners, or directly to our headquarters).

If you feel that one of our standard products would need adaption work to suit your application, please do not hesitate to ask us for advice on engineering work. We can find solutions.